Product features and applications
High thermal conductivity silicone sheet is also a thermally conductive soft silicone sheet. It is one of the heat transfer interface materials. it is a kind of high thermal conductive medium material with excellent thermal conductivity, excellent fireproof property, good buffer property, controllable self-adhesion, selectable thickness, adjustable color, high performance-to-price ratio, low thermal resistance, high suitability, softness and elasticity, protection of sensitive electronic devices, a kind of high thermal conductivity media material with stable quality. It plays a good role in linking the air distance between the heating body and the heat sink, has high thermal conductivity and high pressure resistance, it is the best first choice for thermal conductive material to remove the air layer. High thermal conductivity silica gel sheet has high thermal conductivity, good electrical insulation (only for insulating thermal silica gel sheet), wide use temperature, good use stability, low consistency and good construction simplicity. At the same time, it has low oil separation (towards zero), high and low temperature resistance, water resistance, ozone resistance, and climate aging resistance. Products are widely used, especially the use of high-end electronic products, such as: automotive electronic modules (engines and wipers) power modules, high-power power supplies; calculator applications (CPU,GPU,USICS, hard drive), LED-TV/PDP Wait. And the bottom or frame of the radiator, high-speed hard disk drive, RDRAM memory module, micro heat pipe radiator, automobile engine control device, communication hardware, portable electronic device, semiconductor automatic test equipment. TFT-LCD notebook computer, computer host. High-power LED spotlights, street lamps, fluorescent lights, etc. The heat-generating power devices (integrated circuits, power tubes, thyristors, transformers, etc.) of electronic products and electronic equipment are in close contact with heat dissipation facilities (heat sink, aluminum housings, etc.) to achieve better heat conduction effect. Power devices (power supply, computers, telecommunications) and any places that need to be filled for heat dissipation.
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